Merrimac Industries, Inc. Zapper® SH Package CSDZ-10SH-2.15G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Request a Quote Datasheet
Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Zapper® SH Package - CSDZ-10SH-2.15G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Zapper® SH Package
CSDZ-10SH-2.15G
Zapper® SH Package CSDZ-10SH-2.15G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Supplier's Site Datasheet
Directional Couplers - CSDZ-10SH-2.15G - Crane Aerospace & Electronics
Lynnwood, WA, United States
Directional Couplers
CSDZ-10SH-2.15G
Directional Couplers CSDZ-10SH-2.15G
Package Type | Surface Mount Coupling (dB) | 10±0.5 Frequency Min (MHz) | 2,000 Frequency Max (MHz) | 2,300 CW Power (W) | 150 Insertion Loss (dB) Max | 0.14 Environmental Screening | Catalogue, Mil-screened Directivity Min (dB) | 22
  • Package Type | Surface Mount
  • Coupling (dB) | 10±0.5
  • Frequency Min (MHz) | 2,000
  • Frequency Max (MHz) | 2,300
  • CW Power (W) | 150
  • Insertion Loss (dB) Max | 0.14
  • Environmental Screening | Catalogue, Mil-screened
  • Directivity Min (dB) | 22
Supplier's Site Datasheet

Technical Specifications

  Merrimac Industries, Inc. Crane Aerospace & Electronics
Product Category RF Couplers RF Couplers
Product Number CSDZ-10SH-2.15G CSDZ-10SH-2.15G
Product Name Zapper® SH Package Directional Couplers
RF Coupler Type Uni-Directional Uni-Directional
Package Type Surface Mount Surface Mount; Surface Mount
Frequency Range 2000.00 to 2300.00 MHz 2000.00 to 2300.00 MHz
Directivity 22.00 dB 22.00 dB
Unlock Full Specs
to access all available technical data

Similar Products

RF Directional Coupler - 3157-ZFDC-20-33-N+-ND - DigiKey
Specs
RF Coupler Type Uni-Directional
Package Type Module, SMA Connectors
Frequency Range 20.00 to 3000.00 MHz
View Details
Signal Distribution: High Frequency Film Cards -  - Molex Signal Tech Industrial Ltd.
Molex Signal Tech Industrial Ltd.
Specs
Package Type Surface Mount
Frequency Range 20000.00 MHz
Coupling 3.00 dB
View Details
9 to 10GHz – Waveguide Coupler - UIYWCP10056A - UIY Inc.
Specs
Frequency Range 9000.00 to 10000.00 MHz
Power 5000.00 watts
Coupling 6.00 to 50.00 dB
View Details