Merrimac Industries, Inc. Zapper® SH Package CSDZ-10SH-2.15G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
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Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
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Suppliers

Company
Product
Description
Supplier Links
Zapper® SH Package - CSDZ-10SH-2.15G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Zapper® SH Package
CSDZ-10SH-2.15G
Zapper® SH Package CSDZ-10SH-2.15G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Supplier's Site Datasheet
Directional Couplers - CSDZ-10SH-2.15G - Crane Aerospace & Electronics
Lynnwood, WA, United States
Directional Couplers
CSDZ-10SH-2.15G
Directional Couplers CSDZ-10SH-2.15G
Package Type | Surface Mount Coupling (dB) | 10±0.5 Frequency Min (MHz) | 2,000 Frequency Max (MHz) | 2,300 CW Power (W) | 150 Insertion Loss (dB) Max | 0.14 Environmental Screening | Catalogue, Mil-screened Directivity Min (dB) | 22
  • Package Type | Surface Mount
  • Coupling (dB) | 10±0.5
  • Frequency Min (MHz) | 2,000
  • Frequency Max (MHz) | 2,300
  • CW Power (W) | 150
  • Insertion Loss (dB) Max | 0.14
  • Environmental Screening | Catalogue, Mil-screened
  • Directivity Min (dB) | 22
Supplier's Site Datasheet

Technical Specifications

  Merrimac Industries, Inc. Crane Aerospace & Electronics
Product Category RF Couplers RF Couplers
Product Number CSDZ-10SH-2.15G CSDZ-10SH-2.15G
Product Name Zapper® SH Package Directional Couplers
RF Coupler Type Uni-Directional Uni-Directional
Package Type Surface Mount Surface Mount; Surface Mount
Frequency Range 2000.00 to 2300.00 MHz 2000.00 to 2300.00 MHz
Directivity 22.00 dB 22.00 dB
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