Merrimac Industries, Inc. Standard M Package CSD-10M-3G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet
Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Standard M Package - CSD-10M-3G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Standard M Package
CSD-10M-3G
Standard M Package CSD-10M-3G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Supplier's Site Datasheet

Technical Specifications

  Merrimac Industries, Inc.
Product Category RF Couplers
Product Number CSD-10M-3G
Product Name Standard M Package
RF Coupler Type Uni-Directional
Unlock Full Specs
to access all available technical data

Similar Products

Antenna Couplers -  - Micross Components, Inc.
Micross Components, Inc.
View Details
Directional Couplers - CSC-30-3.7G SQ - Crane Aerospace & Electronics
Crane Aerospace & Electronics
Specs
RF Coupler Type Uni-Directional
Package Type Connectorized; Connectorized
Frequency Range 3200.00 to 4200.00 MHz
View Details
Directional Couplers - WMC-0.5-20-30dB-S - Werbel Microwave LLC
Specs
RF Coupler Type Uni-Directional
Package Type Connectorized Module
Frequency Range 500.00 to 20000.00 MHz
View Details
High Frequency Resistive Coupler - FPC07803 - Knowles Precision Devices
Specs
RF Coupler Type Uni-Directional
Package Type Surface Mount
Impedance 50 ohms
View Details
3 suppliers