Cooler Master Technology Inc. High Performance Thermal Compound; Dispensing Method Cooler Master HTK-002-U1

Description
High Performance Thermal Compound; Dispensing Method:Syringe; Volume:-; Weight:-; Product Range:
  • High Performance Thermal Compound; Dispensing Method Cooler Master - 95K4849 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
High Performance Thermal Compound; Dispensing Method:Syringe; Volume:-; Weight:-; Product Range:

Suppliers

Company
Product
Description
Supplier Links
High Performance Thermal Compound; Dispensing Method Cooler Master - 95K4849 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
High Performance Thermal Compound; Dispensing Method Cooler Master
95K4849
High Performance Thermal Compound; Dispensing Method Cooler Master 95K4849
High Performance Thermal Compound; Dispensing Method:Syringe; Volume:-; Weight:-; Product Range:

High Performance Thermal Compound; Dispensing Method:Syringe; Volume:-; Weight:-; Product Range:

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 95K4849
Product Name High Performance Thermal Compound; Dispensing Method Cooler Master
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed
QSil-553
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Thin Film, Very High Thermal Conductivity - SARCON ® YR-a - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Film, Very High Thermal Conductivity
SARCON ® YR-a
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Toughened, two component epoxy for bonding, sealing and coating - Supreme 34AO - Master Bond, Inc.
Master Bond, Inc.
Toughened, two component epoxy for bonding, sealing and coating
Supreme 34AO
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Grease, Paste
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details