The CP547 wafer process, used for PNP Darlington transistor bare die including the MJ11015 variant, is discontinued and classified as End of Life, with replacement provided by the CP647 process. The MJ11015 die, as used in the WN packaging option, is a full unsawn wafer with 100% testing and reject die inked, with a die size of 195 x 195 mils and a thickness of 11.4 mils. Top side metalization is aluminum at 60,000 Å, and back side metalization consists of Ti/Ni/Au at 1,100 Å/4,000 Å/500 Å.
Bipolar (BJT) Transistor Surface Mount Die
| DigiKey | |
|---|---|
| Product Category | Transistors |
| Product Number | CP547-MJ11015-WN-ND |
| Product Name | Single Bipolar Transistors |
| Package Type | Die |
