16GE + 4 1G/2.5G MULTILAYER SWIT
Manufacturer: Broadcom Limited
Win Source Part Number: 863759-BCM56226B0IPB
Series: *
Features: Interface
Package: Tray
Family Name: BCM56226
Categories: Integrated Circuits (ICs)
Popularity: Medium
Fake Threat In the Open Market: 58 pct.
Supply and Demand Status: Limited
Quantity per package: 168
MSL Level: 1 (Unlimited)
Estimated Pruduction Lead Time: 49 Weeks
REACH Status: REACH Unaffected
16GE + 4 1G/2.5G MULTILAYER SWIT
16GE + 4 1G/2.5G MULTILAYER SWIT
| ODG (Origin Data Global) | Win Source Electronics | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | IC Interfaces | IC Interfaces | IC Interfaces | IC Interfaces | IC Interfaces |
| Product Number | BCM56226B0IPBG | 863759-BCM56226B0IPBG | BCM56226B0IPBG | BCM56226B0IPBG | BCM56226B0IPBG |
| Product Name | Controllers | Interface - Interface - Controllers - BCM56226B0IPBG | Interface - Controllers | Integrated Circuits (ICs) - Interface - Controllers | Controllers |
| Device Type | Sensor Interface | Sensor Interface; CardBus Controller | Sensor Interface; CardBus Controller | CardBus Controller |
