Boyd Thermal Insulator; Insulator Body Material Boyd 53-02-103G

Description
THERMAL INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:-RoHS Compliant: Yes
  • Thermal Insulator; Insulator Body Material Boyd - 89M4417 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:-RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulator; Insulator Body Material Boyd - 89M4417 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulator; Insulator Body Material Boyd
89M4417
Thermal Insulator; Insulator Body Material Boyd 89M4417
THERMAL INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:-RoHS Compliant: Yes

THERMAL INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m.K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:-RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 89M4417
Product Name Thermal Insulator; Insulator Body Material Boyd
Thermal Conductivity 0.9200 W/m-K (0.5316 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Silicone Free Form-in-Place Thermal Gap Filler - SARCON® SPG-25B-NS - Fujipoly® America Corp.
Fujipoly® America Corp.
Silicone Free Form-in-Place Thermal Gap Filler
SARCON® SPG-25B-NS
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Industry Electronics
Use Temperature -40 to 248 F (-40 to 120 C)
View Details
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests - EP46HT-2AO Black - Master Bond, Inc.
Master Bond, Inc.
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests
EP46HT-2AO Black
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details