BAE Systems - Fairchild Imaging Full Frame CCD Sensor CCD6161

Description
The CCD6161 is a 4096(H) x 4096(V) solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD6161 active area is organized as an array of 4096 horizontal by 4096 vertical imaging elements. Addition from 4096(H) x 4096(V) imaging elements there are 8 peripheral columns on left and right edges of imaging area to improve non-uniformity at edges. These 16 peripheral columns are not connected to serial register. There are 32 isolation rows on top and bottom of the imaging area to insure the back illuminate will have 4096 imaging rows. These 64 isolation rows are covered by metal. Which makes the total array is 4112(H) x 4160(V). The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. The imager is available in front-illuminated as well as back-illuminated configuration. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements. 15 µm x 15 µm Pixel 61.44 mm x 61.44 mm Image Area 100% Fill Factor Milti-Pinned Phase (MPP) Operation Readout Noise Less Than 5 e- at 50k pixels/sec Dynamic Range Better Than 86 dB in MPP Four Low Noise Output Amplifiers Three Phase Buried Channel CCD Supports Pixel Binning
Description
The CCD6161 is a 4096(H) x 4096(V) solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD6161 active area is organized as an array of 4096 horizontal by 4096 vertical imaging elements. Addition from 4096(H) x 4096(V) imaging elements there are 8 peripheral columns on left and right edges of imaging area to improve non-uniformity at edges. These 16 peripheral columns are not connected to serial register. There are 32 isolation rows on top and bottom of the imaging area to insure the back illuminate will have 4096 imaging rows. These 64 isolation rows are covered by metal. Which makes the total array is 4112(H) x 4160(V). The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. The imager is available in front-illuminated as well as back-illuminated configuration. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements. 15 µm x 15 µm Pixel 61.44 mm x 61.44 mm Image Area 100% Fill Factor Milti-Pinned Phase (MPP) Operation Readout Noise Less Than 5 e- at 50k pixels/sec Dynamic Range Better Than 86 dB in MPP Four Low Noise Output Amplifiers Three Phase Buried Channel CCD Supports Pixel Binning

Suppliers

Company
Product
Description
Supplier Links
Full Frame CCD Sensor - CCD6161 - BAE Systems - Fairchild Imaging
Milpitas, CA, USA
Full Frame CCD Sensor
CCD6161
Full Frame CCD Sensor CCD6161
The CCD6161 is a 4096(H) x 4096(V) solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD6161 active area is organized as an array of 4096 horizontal by 4096 vertical imaging elements. Addition from 4096(H) x 4096(V) imaging elements there are 8 peripheral columns on left and right edges of imaging area to improve non-uniformity at edges. These 16 peripheral columns are not connected to serial register. There are 32 isolation rows on top and bottom of the imaging area to insure the back illuminate will have 4096 imaging rows. These 64 isolation rows are covered by metal. Which makes the total array is 4112(H) x 4160(V). The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. The imager is available in front-illuminated as well as back-illuminated configuration. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements. 15 µm x 15 µm Pixel 61.44 mm x 61.44 mm Image Area 100% Fill Factor Milti-Pinned Phase (MPP) Operation Readout Noise Less Than 5 e- at 50k pixels/sec Dynamic Range Better Than 86 dB in MPP Four Low Noise Output Amplifiers Three Phase Buried Channel CCD Supports Pixel Binning

The CCD6161 is a 4096(H) x 4096(V) solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD6161 active area is organized as an array of 4096 horizontal by 4096 vertical imaging elements. Addition from 4096(H) x 4096(V) imaging elements there are 8 peripheral columns on left and right edges of imaging area to improve non-uniformity at edges. These 16 peripheral columns are not connected to serial register. There are 32 isolation rows on top and bottom of the imaging area to insure the back illuminate will have 4096 imaging rows. These 64 isolation rows are covered by metal. Which makes the total array is 4112(H) x 4160(V). The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. The imager is available in front-illuminated as well as back-illuminated configuration. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements.

  • 15 µm x 15 µm Pixel
  • 61.44 mm x 61.44 mm Image Area
  • 100% Fill Factor
  • Milti-Pinned Phase (MPP) Operation
  • Readout Noise Less Than 5 e- at 50k pixels/sec
  • Dynamic Range Better Than 86 dB in MPP
  • Four Low Noise Output Amplifiers
  • Three Phase Buried Channel CCD
  • Supports Pixel Binning
Supplier's Site

Technical Specifications

  BAE Systems - Fairchild Imaging
Product Category CCD Image Sensors
Product Number CCD6161
Product Name Full Frame CCD Sensor
CCD Type Full Frame Area Array
Horizontal Pixels 4096
Vertical Pixels 4096
Pixel Size 15 µm (0.5906 mils)
Operating Temperature -90 to 40 C (-130 to 104 F)
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