ATV Technologie GmbH IR Vacuum Reflow System SRO-716

Description
With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements. The Solder Reflow Ovens (SRO) 714 and 716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid. Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and 716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or 716 our 100-Step-Recipe will make programming easy and guarantee superb process results. Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and 716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run. Technical Data SRO-714/716 ​Footprint: 960 x 720 x 1340mm (LxWxH) Weight: 240kg. (options dependent) ​Chamber Height: up-to 100mm ​Heated Area: SRO-714 230 x 217mm SRO-716 314 x 314mm ​Chamber Lid Open/Closing: Manual ​Heating Method: SRO-714 IR (8pcs. Lamp Array) SRO-716 IR (12pcs. Lamp Array) ​Heating Zones: SRO-714 2 SRO-716 3 ​Power connection: 3Ph.-N-PE 230/400V 50/60Hz ​Power: SRO-714 6,5kW SRO-716 17kW Features SRO-714/716 Flux-less Direct IR Heating Surface touch TC Multiple TC monitoring Ceramic Heater Plate Process temperature 450°C up to 750°C Temperature ramp-up rate 3,5K/sec. Temperature cool-down rate 2K/sec. Rapid single wafer processing < 20°C/sec. Oxygen < 1,0ppm with purified N2 HELIUM leak rate 5 x 10¯9 mbarl/sec. 100 step recipe Common Applications SRO-714/716 IGBT/DBC Power Semiconductors Sensors/IR Bolometer Detector MEMS Devices DIE Attachment High Power LED Hybrid Assembly Flip Chip Package Sealing MMICs Transient liquid phase soldering/bonding Ag sintering Thermo compression bonding CPV, Laser bar
Description
With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements. The Solder Reflow Ovens (SRO) 714 and 716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid. Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and 716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or 716 our 100-Step-Recipe will make programming easy and guarantee superb process results. Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and 716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run. Technical Data SRO-714/716 ​Footprint: 960 x 720 x 1340mm (LxWxH) Weight: 240kg. (options dependent) ​Chamber Height: up-to 100mm ​Heated Area: SRO-714 230 x 217mm SRO-716 314 x 314mm ​Chamber Lid Open/Closing: Manual ​Heating Method: SRO-714 IR (8pcs. Lamp Array) SRO-716 IR (12pcs. Lamp Array) ​Heating Zones: SRO-714 2 SRO-716 3 ​Power connection: 3Ph.-N-PE 230/400V 50/60Hz ​Power: SRO-714 6,5kW SRO-716 17kW Features SRO-714/716 Flux-less Direct IR Heating Surface touch TC Multiple TC monitoring Ceramic Heater Plate Process temperature 450°C up to 750°C Temperature ramp-up rate 3,5K/sec. Temperature cool-down rate 2K/sec. Rapid single wafer processing < 20°C/sec. Oxygen < 1,0ppm with purified N2 HELIUM leak rate 5 x 10¯9 mbarl/sec. 100 step recipe Common Applications SRO-714/716 IGBT/DBC Power Semiconductors Sensors/IR Bolometer Detector MEMS Devices DIE Attachment High Power LED Hybrid Assembly Flip Chip Package Sealing MMICs Transient liquid phase soldering/bonding Ag sintering Thermo compression bonding CPV, Laser bar

Suppliers

Company
Product
Description
Supplier Links
IR Vacuum Reflow System - SRO-716 - ATV Technologie GmbH
Antioch, CA, USA
IR Vacuum Reflow System
SRO-716
IR Vacuum Reflow System SRO-716
With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements. The Solder Reflow Ovens (SRO) 714 and 716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid. Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and 716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or 716 our 100-Step-Recipe will make programming easy and guarantee superb process results. Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and 716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run. Technical Data SRO-714/716 ​Footprint: 960 x 720 x 1340mm (LxWxH) Weight: 240kg. (options dependent) ​Chamber Height: up-to 100mm ​Heated Area: SRO-714 230 x 217mm SRO-716 314 x 314mm ​Chamber Lid Open/Closing: Manual ​Heating Method: SRO-714 IR (8pcs. Lamp Array) SRO-716 IR (12pcs. Lamp Array) ​Heating Zones: SRO-714 2 SRO-716 3 ​Power connection: 3Ph.-N-PE 230/400V 50/60Hz ​Power: SRO-714 6,5kW SRO-716 17kW Features SRO-714/716 Flux-less Direct IR Heating Surface touch TC Multiple TC monitoring Ceramic Heater Plate Process temperature 450°C up to 750°C Temperature ramp-up rate 3,5K/sec. Temperature cool-down rate 2K/sec. Rapid single wafer processing < 20°C/sec. Oxygen < 1,0ppm with purified N2 HELIUM leak rate 5 x 10¯9 mbarl/sec. 100 step recipe Common Applications SRO-714/716 IGBT/DBC Power Semiconductors Sensors/IR Bolometer Detector MEMS Devices DIE Attachment High Power LED Hybrid Assembly Flip Chip Package Sealing MMICs Transient liquid phase soldering/bonding Ag sintering Thermo compression bonding CPV, Laser bar

With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements.

The Solder Reflow Ovens (SRO) 714 and 716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid.

Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and 716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or 716 our 100-Step-Recipe will make programming easy and guarantee superb process results.

Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and 716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.

Technical Data SRO-714/716

​Footprint:

960 x 720 x 1340mm (LxWxH)

Weight:

240kg. (options dependent)

​Chamber Height:

up-to 100mm

​Heated Area:

SRO-714 230 x 217mm

SRO-716 314 x 314mm

​Chamber Lid Open/Closing:

Manual

​Heating Method:

SRO-714 IR (8pcs. Lamp Array)

SRO-716 IR (12pcs. Lamp Array)

​Heating Zones:

SRO-714 2

SRO-716 3

​Power connection:

3Ph.-N-PE 230/400V 50/60Hz

​Power:

SRO-714 6,5kW

SRO-716 17kW

Features SRO-714/716

Flux-less

Direct IR Heating

Surface touch TC

Multiple TC monitoring

Ceramic Heater Plate

Process temperature 450°C up to 750°C

Temperature ramp-up rate 3,5K/sec.

Temperature cool-down rate 2K/sec.

Rapid single wafer processing < 20°C/sec.

Oxygen < 1,0ppm with purified N2

HELIUM leak rate 5 x 10¯9 mbarl/sec.

100 step recipe

Common Applications SRO-714/716

IGBT/DBC

Power Semiconductors

Sensors/IR Bolometer Detector

MEMS Devices

DIE Attachment

High Power LED

Hybrid Assembly

Flip Chip

Package Sealing

MMICs

Transient liquid phase soldering/bonding

Ag sintering

Thermo compression bonding

CPV, Laser bar

Supplier's Site

Technical Specifications

  ATV Technologie GmbH
Product Category Reflow Ovens
Product Number SRO-716
Product Name IR Vacuum Reflow System
Temperature Range 450 F (232 C)
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