CHIPLED, white (0.29, 0.27), compact package
Product Features
Package: SMT package 0402 colored diffused resin
Feature of the device: compact package
Color: Cx = 0.29, Cy = 0.27 acc. to CIE 1931 (white); CTR = 5600 K
Viewing angle at 50 % IV: 115 (horizontal)160 (vertical)
Technology: InGaN
Optical efficiency (typ.): 40 lm/W (white)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: ESD sensitive device acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0)
CHIPLED, white (0.29, 0.27), compact package
Product Features
- Package: SMT package 0402 colored diffused resin
- Feature of the device: compact package
- Color: Cx = 0.29, Cy = 0.27 acc. to CIE 1931 (white); CTR = 5600 K
- Viewing angle at 50 % IV: 115 (horizontal)160 (vertical)
- Technology: InGaN
- Optical efficiency (typ.): 40 lm/W (white)
- Assembly methods: suitable for all SMT assembly methods
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
- ESD - withstand voltage: ESD sensitive device acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0)
