Multi CHIPLED, white (0.267, 0.231)
Product Features
Package: SMT package silicone resin
Color: Cx = 0.27, Cy = 0.23 acc. to CIE 1931 (white)
Technology: ThinGaN (white), InGaAlP Thinfilm (, )
Grouping parameter: luminous intensity wavelength
Assembly methods: suitable for all SMT assembly methods
Soldering methods: Reflow soldering
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with
ESD - withstand voltage: ESD sensitive device acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0)
Multi CHIPLED, white (0.267, 0.231)
Product Features
- Package: SMT package silicone resin
- Color: Cx = 0.27, Cy = 0.23 acc. to CIE 1931 (white)
- Technology: ThinGaN (white), InGaAlP Thinfilm (, )
- Grouping parameter: luminous intensity wavelength
- Assembly methods: suitable for all SMT assembly methods
- Soldering methods: Reflow soldering
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 8 mm tape with
- ESD - withstand voltage: ESD sensitive device acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0)
