Mini TOPLED, orange (O), white SMT package, colorless clear resin
Product Features
Package: SMD epoxy package
Feature of the device: small package for applications where small space is required
Color: orange (606 nm)
Viewing angle at 50 % IV: 120
Technology: InGaAlP Thinfilm
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 3000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
Mini TOPLED, orange (O), white SMT package, colorless clear resin
Product Features
- Package: SMD epoxy package
- Feature of the device: small package for applications where small space is required
- Color: orange (606 nm)
- Viewing angle at 50 % IV: 120
- Technology: InGaAlP Thinfilm
- Assembly methods: suitable for all SMT assembly methods
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 8 mm tape with 3000 pcs. on ∅ 180 mm reel
- ESD - withstand voltage: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
