CHIPLED 0805, hyper red (645 nm), compact package
Product Features
Package: SMT package 0805 colorless diffused resin
Feature of the device: compact package
Color: hyper red (645 nm)
Viewing angle at 50 % IV: 160
Technology: GaAlAs
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: up to 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
CHIPLED 0805, hyper red (645 nm), compact package
Product Features
- Package: SMT package 0805 colorless diffused resin
- Feature of the device: compact package
- Color: hyper red (645 nm)
- Viewing angle at 50 % IV: 160
- Technology: GaAlAs
- Assembly methods: suitable for all SMT assembly methods
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
- ESD - withstand voltage: up to 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
