Mini TOPLED, green, colorless clear
Product Features
Package: white SMT package, colorless clear resin
Feature of the device: small package for applications where small space is required
Color: green (570 nm)
Viewing angle at 50 % IV: 120
Technology: GaAsP
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 3000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: up to 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
Mini TOPLED, green, colorless clear
Product Features
- Package: white SMT package, colorless clear resin
- Feature of the device: small package for applications where small space is required
- Color: green (570 nm)
- Viewing angle at 50 % IV: 120
- Technology: GaAsP
- Assembly methods: suitable for all SMT assembly methods
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 8 mm tape with 3000 pcs. on ∅ 180 mm reel
- ESD - withstand voltage: up to 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
