High brightness LED in multi-chip in SMT technology, 4-chip, multicolor, long lifetime
Product Features
Package: compact lightsource in multi chip SMT technology with glass window on top
Feature of the device: outstanding brightness and luminance due to pure surface emission and low Rth
Color: Cx = 0.46, Cy = 0.41 acc. to CIE 1931 (warm white), Cx = 0.30, Cx = 0.30 acc. to CIE 1931 (ultra white)
Viewing angle at 50 % IV: 120
Assembly methods: reflow soldering
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 12 mm tape with 500 pcs. on 180 mm reel
ESD - withstand voltage: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
High brightness LED in multi-chip in SMT technology, 4-chip, multicolor, long lifetime
Product Features
- Package: compact lightsource in multi chip SMT technology with glass window on top
- Feature of the device: outstanding brightness and luminance due to pure surface emission and low Rth
- Color: Cx = 0.46, Cy = 0.41 acc. to CIE 1931 (warm white), Cx = 0.30, Cx = 0.30 acc. to CIE 1931 (ultra white)
- Viewing angle at 50 % IV: 120
- Assembly methods: reflow soldering
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 12 mm tape with 500 pcs. on 180 mm reel
- ESD - withstand voltage: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
