Golden DRAGON, warm white, ThinGaN, chip level conversion, 1000 mA max. current
Product Features
Package: white SMD package, colorless clear silicone resin chip level conversion
Feature of the device: high efficient lightsource at low space
Color: Cx = 0.42, Cy = 0.40 acc. to CIE 1931 (warm white); CRI (typ.) = 80; CTR = 2500 K - 4800 K
Viewing angle at 50 % IV: 120
Technology: ThinGaN
Optical efficiency (typ.): 87 lm/W (warm white) at 3500 K
Optical efficiency (max.): 87 lm/W at 100 mA (3500 K)
Assembly methods: suitable for all SMT assembly methods
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 24 mm tape with 800 pcs. on ∅ 180 mm reel
ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Golden DRAGON, warm white, ThinGaN, chip level conversion, 1000 mA max. current
Product Features
- Package: white SMD package, colorless clear silicone resin chip level conversion
- Feature of the device: high efficient lightsource at low space
- Color: Cx = 0.42, Cy = 0.40 acc. to CIE 1931 (warm white); CRI (typ.) = 80; CTR = 2500 K - 4800 K
- Viewing angle at 50 % IV: 120
- Technology: ThinGaN
- Optical efficiency (typ.): 87 lm/W (warm white) at 3500 K
- Optical efficiency (max.): 87 lm/W at 100 mA (3500 K)
- Assembly methods: suitable for all SMT assembly methods
- Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
- Packing unit: 24 mm tape with 800 pcs. on ∅ 180 mm reel
- ESD - withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
