Amphenol Corporation Headers & Wire Housings G888A102221TEU

Description
Protect Header 2.54mm Pitch STR DIP,1x2P
  • Headers & Wire Housings - G888A102221TEU - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
Protect Header 2.54mm Pitch STR DIP,1x2P
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - G888A102221TEU - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
G888A102221TEU
Headers & Wire Housings G888A102221TEU
Protect Header 2.54mm Pitch STR DIP,1x2P

Protect Header 2.54mm Pitch STR DIP,1x2P

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number G888A102221TEU
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Related Documents

Similar Products

ES Micro Series H-Pin® Socket - - Smiths Interconnect, a Molex company
Smiths Interconnect, a Molex company
ES Micro Series H-Pin® Socket
Specs
Product Type IC Socket
Socket Type BGA; LGA
Operating Temperature 200 C (392 F)
View Details
Wire-Board Conn, Header, 20Pos, 2.54Mm; Connector Type Amphenol Communications Solutions - 68K8236 - Newark, An Avnet Company
Amphenol Communications Solutions
Wire-Board Conn, Header, 20Pos, 2.54Mm; Connector Type Amphenol Communications Solutions
53611-S20-8LF
Specs
Product Type IC Headers
Contact Plating Gold; Gold
Number of Contacts 20
View Details
718 Series CSP/BGA/QFN Devices Lidded - - Sensata Technologies
Sensata Technologies
718 Series CSP/BGA/QFN Devices Lidded
Specs
Product Type IC Socket
Contact Resistance 350 milliohms
Operating Temperature 125 C (257 F)
View Details
Headers & Wire Housings - B5743-216-M-L-1 - Powell Electronics, Inc.
Harwin Plc
Headers & Wire Housings
B5743-216-M-L-1
Specs
Product Type IC Headers
View Details