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Sensata Technologies 718 Series CSP/BGA/QFN Devices Lidded

Description
Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
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718 Series CSP/BGA/QFN Devices Lidded -  - Sensata Technologies
Attleboro, MA, USA
718 Series CSP/BGA/QFN Devices Lidded
718 Series CSP/BGA/QFN Devices Lidded
Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
  • Clamshell design, compression surface mount
  • Spring and probe contact
  • Pointed probe maintains continuous contact to PCB
  • Spring loaded pressure pad and locator plate
  • Multi-site options are available
  • Any pitch or pitch combination .4mm and greater
  • Threaded inserts available
  • Available with high performance pin
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 718 Series CSP/BGA/QFN Devices Lidded
Product Type IC Socket
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