Smiths Interconnect, a Molex company ES Micro Series H-Pin® Socket

Description
ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors. Features & Benefits Configurable design, In-house tooling and molds allow for the lowest cost of test. An extensive catalog of standard parts reduces cost and lead time. Double-latching clamshell provides ease of use during operation and clearance for lid operation. Exceptional electrical performance provides wide RF bandwidth. Feature Options LGA, BGA, and package on package Spring loaded plunger Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Max component clearance under the DUT High temperature materials for above 200 °C applications
Request a Quote Datasheet
Description
ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors. Features & Benefits Configurable design, In-house tooling and molds allow for the lowest cost of test. An extensive catalog of standard parts reduces cost and lead time. Double-latching clamshell provides ease of use during operation and clearance for lid operation. Exceptional electrical performance provides wide RF bandwidth. Feature Options LGA, BGA, and package on package Spring loaded plunger Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Max component clearance under the DUT High temperature materials for above 200 °C applications
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
ES Micro Series H-Pin® Socket -  - Smiths Interconnect, a Molex company
London, United Kingdom
ES Micro Series H-Pin® Socket
ES Micro Series H-Pin® Socket
ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors. Features & Benefits Configurable design, In-house tooling and molds allow for the lowest cost of test. An extensive catalog of standard parts reduces cost and lead time. Double-latching clamshell provides ease of use during operation and clearance for lid operation. Exceptional electrical performance provides wide RF bandwidth. Feature Options LGA, BGA, and package on package Spring loaded plunger Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Max component clearance under the DUT High temperature materials for above 200 °C applications

ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors.

Features & Benefits

  • Configurable design, In-house tooling and molds allow for the lowest cost of test.
  • An extensive catalog of standard parts reduces cost and lead time.
  • Double-latching clamshell provides ease of use during operation and clearance for lid operation.
  • Exceptional electrical performance provides wide RF bandwidth.

Feature Options

  • LGA, BGA, and package on package
  • Spring loaded plunger
  • Heat sink
  • HAST venting features
  • Integrated thermal control with heater and sensor
  • Reverse seating plane
  • Max component clearance under the DUT
  • High temperature materials for above 200 °C applications
Supplier's Site Datasheet

Technical Specifications

  Smiths Interconnect, a Molex company
Product Category IC Interconnect Components
Product Name ES Micro Series H-Pin® Socket
Product Type IC Socket
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