MacDermid Alpha Electronics Solutions Damascene Process Chemicals for Semiconductor Manufacturing ViaForm ®

Product Overview ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry is specifically designed for manufacturing advanced copper interconnects and provides a high degree of process control. ViaForm enables robust interconnect fill capability, ensuring superior device yield and reliability. Product Features Unique Custom Solutions Custom solution packages leveraging the latest ViaForm products, developed through close customer collaboration. Pioneering Advanced Copper Technologies ViaForm delivers fast, void-free fill with a broad operating window, excellent across wafer uniformity, and customized impurity control to meet reliability needs. Best-in-class Manufacturing Capability ViaForm chemistry is produced in our High-Volume Manufacturing (HVM) and advanced research facilities. Featured Applications Wafer Fabrication ViaForm products, used in the dual-damascene process, enable bottom-up copper electroplating to achieve void-free metallization of complex nano patterns.