MacDermid Alpha Electronics Solutions PCB Process Chemicals for Circuit Formation UltraStrip LDI

Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
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Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
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PCB Process Chemicals for Circuit Formation - UltraStrip LDI - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
PCB Process Chemicals for Circuit Formation
UltraStrip LDI
PCB Process Chemicals for Circuit Formation UltraStrip LDI
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

Product Overview

The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number UltraStrip LDI
Product Name PCB Process Chemicals for Circuit Formation
Chemical / Composition Tin Plating; Tin-lead Plating
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