MacDermid Alpha Electronics Solutions Copper Via Filling Solutions for High Density Interconnect PCBs MacuSpec ™ VF-TH 500

Product Overview MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel plating and modified Semi-Additive Processing (mSAP) pattern plating. This versatile solution enables fabricators to meet stringent reliability and performance requirements for complex, multilayer boards used in next-generation technologies. Product Features High Performance Via Filling and Through Hole Plating The chemistry provides high via filling performance for via sizes up to 200 x 100 µm. Fabricators can expect a reliable deposit and improved throwing power at the knee and through hole. Enhanced Reliability for Complex, Multilayer Printed Circuit Boards (PCBs) MacuSpec VF-TH 500 exhibits excellent physical (Passing IPC Class III) and thermal reliability properties in solder dip, IR reflow, and OM test (IPC-TM-650 2.6.8, 2.6.26 and 2.6.27). Compatible with Primary Metallization Processes MacuSpec VF-TH 500 is compatible with direct metallization or electroless copper with epitaxial growth across the interface for reliable microvias. Featured Applications Panel plating and modified Semi-Additive Processing (mSAP) pattern plating MacuSpec VF-TH 500 is designed to provide highly reliable interconnects for challenging stacked multilayer boards used in next-generation communications, high performance computing and automotive applications.