MacDermid Alpha Electronics Solutions Panel Level Packaging Metallization Solutions Systek ™ VTP 100

Product Overview The Systek™ VTP 100 acid copper plating system offers unmatched precision for Redistribution Layer (RDL) plating and via filling across a wide range of line, space, and via dimensions. Ideal for 3D and fan-out designs, Systek VTP 100 is part of our Panel Level Packaging (PLP) Portfolio, enabling seamless I/O re-routing and uniform line profiles. The chemistry enables plating speeds of up to 7.5 ASD and is formulated to achieve bottom-up via filling while maintaining a flat line profile with excellent uniformity. Product Features Excellent Via Fill Capability Systek VTP 100 delivers high precision via fill capability and RDL performance for many devices and a wide range of line, space and via dimensions . High-Speed Plating Systek VTP 100 is capable of plating speeds up to 7.5 ASD depending on via size, and is formulated to achieve bottom-up via filling. Good Physical Properties Maintains a flat line profile with excellent uniformity.