MacDermid Alpha Electronics Solutions Copper Adhesion Promoters for IC Substrates M-Speed HF

Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize maximum signal integrity and uniform trace geometry for controlled impedance designs. The process results in a low copper roughness profile combined with a silane post-dip, enabling a low-loss, high-reliability combination of mechanical and chemical bonding. Product Features Exceptional Surface Topography Excellent surface topography on all three exposed sides of the copper trace ensures that electrical properties meet the needs of high-frequency designs. Excellent Adhesion and Thermal Resistance Enabled by a combination of mechanical and chemical bonding, this process reduces peak-to-valley roughness on the copper surface, making it superior for fine traces. Superior Innerlayer Bonding The surface created by M-Speed HF offers unparalleled innerlayer bonding to a wide variety of resin systems and dielectric films. Featured Applications High-Speed, Low Loss Reduced copper roughness leads to reduced signal attenuation and superior reliability for high-layer-count designs.