Product Overview
Systek SAP begins with a three-step Semi-Additive Process (SAP) desmear process that can be calibrated to optimally prepare multiple substrate materials, depending on the fabricator’s design requirements. First, a permanganate etch removes laser debris from via walls and target pads. Next, a neutralizer reduces permanganate residues from the surface. Finally, a glass etch promotes uniform palladium adsorption on glass build-up materials. The result is a perfect balance of minimal roughness and consistently clean via sidewalls and copper target pads for maximum adhesion.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | Systek ™ SAP Desmear |
| Product Name | Semi-Additive Process (SAP) Solutions for IC Substrates |
