MacDermid Alpha Electronics Solutions Periodic Pulse Reverse Plating for PCBs PC 600

Description
Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.
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Description
Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.
Request a Quote

Suppliers

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Periodic Pulse Reverse Plating for PCBs - PC 600 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Periodic Pulse Reverse Plating for PCBs
PC 600
Periodic Pulse Reverse Plating for PCBs PC 600
Product Overview PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1. The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.

Product Overview

PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1.

The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number PC 600
Product Name Periodic Pulse Reverse Plating for PCBs
Chemical / Composition Copper Plating; Tin Plating
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