Product Overview
The MICROFAB GSW-100 Copper process has been engineered to produce a low-stress copper deposit in compound semiconductor, backside, and via conformal plating applications. It provides good throwing power into via bottoms. The deposit is low-stress and pure. This product is formulated, packaged and quality controlled according to the needs of the semiconductor industry.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® GSW-100 |
| Product Name | Wafer Bumping Metallization solutions for Semiconductor Packaging |
| Chemical / Composition | Copper Plating; Hard Nickel Plating; Tin Plating |
