Product Overview
MICROFAB AU660 is a high-purity (99.99%) gold electroplating process frequently used in bump plating on metallized silicon wafers. Designed for backside interconnect (via liner) and fine-pitch pattern gold bumping, it delivers high plating rates (>0.5 µm/min) and approximately twice the step coverage of conventional gold plating, enabling field thinning and reducing cost of ownership.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® AU660 |
| Product Name | Redistribution Layer for Wafer Level Packaging |
| Chemical / Composition | Gold Plating; Tin Plating; Soft / High Purity |
