MacDermid Alpha Electronics Solutions Gold Etch Materials MICROFAB ® AU100 CT DEPLATE

Description
Product Overview Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. To help reduce operating costs, we’ve developed a non-cyanide deplate system to complement our best-in-class gold processes. For a consultation with one of our experts and access to detailed technical data, please complete the form below.
Request a Quote
Description
Product Overview Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. To help reduce operating costs, we’ve developed a non-cyanide deplate system to complement our best-in-class gold processes. For a consultation with one of our experts and access to detailed technical data, please complete the form below.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Gold Etch Materials - MICROFAB ® AU100 CT DEPLATE - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Gold Etch Materials
MICROFAB ® AU100 CT DEPLATE
Gold Etch Materials MICROFAB ® AU100 CT DEPLATE
Product Overview Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. To help reduce operating costs, we’ve developed a non-cyanide deplate system to complement our best-in-class gold processes. For a consultation with one of our experts and access to detailed technical data, please complete the form below.

Product Overview

Gold plating solutions have advanced significantly to support fine line features, step coverage, and bump plating. To help reduce operating costs, we’ve developed a non-cyanide deplate system to complement our best-in-class gold processes.

For a consultation with one of our experts and access to detailed technical data, please complete the form below.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number MICROFAB ® AU100 CT DEPLATE
Product Name Gold Etch Materials
Chemical / Composition Gold Plating; Tin Plating
Unlock Full Specs
to access all available technical data

Similar Products

Electroless Copper Plating Solutions for PCBs - Via Dep ® 4550 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating; Electroless
View Details
Molded Interconnect Device Plating - Fine Line Plating Enhancer: LDS Selectcoat 100 FL - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Silver Plating; Tin Plating; Electroless
View Details
Copper Via Filling Solutions for High Density Interconnect PCBs - MacuSpec ™ VF-TH 500 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating; Electroless
View Details
Damascene Process Chemicals for Semiconductor Manufacturing - ViaForm ® - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Tin Plating
View Details