MacDermid Alpha Electronics Solutions Periodic Pulse Reverse Plating for PCBs MacuSpec ™ MPR 100

Description
Product Overview MacuSpec MPR 100 is a pulse plating process designed as a cost-effective option for mid-aspect ratio technologies, supporting aspect ratios up to 15:1. When used with basic, lower-cost pulse rectification, it offers a practical alternative to high-throwing-power Direct Current (DC) plating by delivering improved throwing power, reduced surface copper, and increased plating rates. The result is greater throughput, lower copper anode consumption, and reduced copper etching requirements.
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Description
Product Overview MacuSpec MPR 100 is a pulse plating process designed as a cost-effective option for mid-aspect ratio technologies, supporting aspect ratios up to 15:1. When used with basic, lower-cost pulse rectification, it offers a practical alternative to high-throwing-power Direct Current (DC) plating by delivering improved throwing power, reduced surface copper, and increased plating rates. The result is greater throughput, lower copper anode consumption, and reduced copper etching requirements.
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Periodic Pulse Reverse Plating for PCBs - MacuSpec ™ MPR 100 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Periodic Pulse Reverse Plating for PCBs
MacuSpec ™ MPR 100
Periodic Pulse Reverse Plating for PCBs MacuSpec ™ MPR 100
Product Overview MacuSpec MPR 100 is a pulse plating process designed as a cost-effective option for mid-aspect ratio technologies, supporting aspect ratios up to 15:1. When used with basic, lower-cost pulse rectification, it offers a practical alternative to high-throwing-power Direct Current (DC) plating by delivering improved throwing power, reduced surface copper, and increased plating rates. The result is greater throughput, lower copper anode consumption, and reduced copper etching requirements.

Product Overview

MacuSpec MPR 100 is a pulse plating process designed as a cost-effective option for mid-aspect ratio technologies, supporting aspect ratios up to 15:1. When used with basic, lower-cost pulse rectification, it offers a practical alternative to high-throwing-power Direct Current (DC) plating by delivering improved throwing power, reduced surface copper, and increased plating rates.

The result is greater throughput, lower copper anode consumption, and reduced copper etching requirements.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number MacuSpec ™ MPR 100
Product Name Periodic Pulse Reverse Plating for PCBs
Chemical / Composition Copper Plating; Tin Plating
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