MacDermid Alpha Electronics Solutions Molded Interconnect Device Plating Copper Plating: MID Copper 100

Description
Product Overview As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper provides unmatched yields and high plating rates from a chemical process with exceptional stability.
Request a Quote
Description
Product Overview As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper provides unmatched yields and high plating rates from a chemical process with exceptional stability.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Molded Interconnect Device Plating - Copper Plating: MID Copper 100 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Molded Interconnect Device Plating
Copper Plating: MID Copper 100
Molded Interconnect Device Plating Copper Plating: MID Copper 100
Product Overview As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper provides unmatched yields and high plating rates from a chemical process with exceptional stability.

Product Overview

As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper provides unmatched yields and high plating rates from a chemical process with exceptional stability.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Copper Plating: MID Copper 100
Product Name Molded Interconnect Device Plating
Chemical / Composition Copper Plating; Hard Nickel Plating; Silver Plating; Tin Plating; Electroless
Unlock Full Specs
to access all available technical data

Similar Products

Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® SC-32 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Hard Nickel Plating; Tin Plating
View Details
Periodic Pulse Reverse Plating for PCBs - PC 610 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating
View Details
Molded Interconnect Device Plating - Enplate ® LDS NI 200 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Silver Plating; Tin Plating; Electroless
View Details
Electronic Connector Plating Processes - Copper Bright, Matte - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Hard Nickel Plating; Tin Plating
View Details