Product Overview
MacuSpec HT 200 is specifically formulated to deliver high microdistribution at higher current densities, enabling increased throughput. This makes it an excellent choice for continuous vertical plating systems. It produces a bright, smooth, and ductile copper deposit within a current density range of 5 to 30 ASF and is capable of plating through holes with aspect ratios up to 10:1. The mechanical properties of the deposit exceed Institute of Printed Circuit Board (IPC) specifications across the entire current density range.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MacuSpec ™ HT 200 |
| Product Name | High-Throw Direct Current Acid Copper Plating |
| Chemical / Composition | Copper Plating; Tin Plating |
