MacDermid Alpha Electronics Solutions Redistribution Layer for Wafer Level Packaging BDT-510

Description
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.
Request a Quote
Description
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Redistribution Layer for Wafer Level Packaging - BDT-510 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Redistribution Layer for Wafer Level Packaging
BDT-510
Redistribution Layer for Wafer Level Packaging BDT-510
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.

Product Overview

BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number BDT-510
Product Name Redistribution Layer for Wafer Level Packaging
Chemical / Composition Tin Plating; Soft / High Purity
Unlock Full Specs
to access all available technical data

Similar Products

Molded Interconnect Device Plating - Enplate ® LDS NI 200 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Silver Plating; Tin Plating; Electroless
View Details
Periodic Pulse Reverse Plating for PCBs - MacuSpec ™ PPR 100 & 200 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating
View Details
Precious Metal Plating for Electronic Connectors - Low Speed Silver - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Silver Plating; Tin Plating
View Details
Acid Copper Electroplating for IC Substrates - Systek ™ ETS Series - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating
View Details