MacDermid Alpha Electronics Solutions Molded Interconnect Device Plating MID LT Nickel 100

Description
Product Overview Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems, all offering exceptional stability. Each process delivers excellent thickness uniformity along with corrosion and salt spray resistance.
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Description
Product Overview Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems, all offering exceptional stability. Each process delivers excellent thickness uniformity along with corrosion and salt spray resistance.
Request a Quote

Suppliers

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Molded Interconnect Device Plating - MID LT Nickel 100 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Molded Interconnect Device Plating
MID LT Nickel 100
Molded Interconnect Device Plating MID LT Nickel 100
Product Overview Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems, all offering exceptional stability. Each process delivers excellent thickness uniformity along with corrosion and salt spray resistance.

Product Overview

Our MID LT Nickel 100 is designed for low, medium, and high-phosphorus nickel systems, all offering exceptional stability. Each process delivers excellent thickness uniformity along with corrosion and salt spray resistance.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number MID LT Nickel 100
Product Name Molded Interconnect Device Plating
Chemical / Composition Hard Nickel Plating; Silver Plating; Tin Plating
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