MacDermid Alpha Electronics Solutions Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® CVP-520 Solder Paste

Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux residue is clear, colorless, and provides excellent electrochemical reliability. The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point and the narrowest pasty range during melting and re-solidification, maximizing resistance to thermal-cycle-based fatigue in traditional low-temperature alloy applications. The alloy also yields very low voiding in Ball Grid Array (BGA) solder joints, even when a traditional Tin-Silver-Copper (SAC) alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C. Product Features Eliminates the Need for a Second or Third Reflow Cycle Eliminates the need for a second or third reflow cycle when temperature-sensitiv e components are used. Reduce Energy Consumption in Reflow Ovens for Greater Efficiency Low-temperature alloys reduce energy consumption in reflow ovens compared to standard lead-free alloys. 8-Hour Stencil Life Lower Reflow Profiles Enable the Use of Low Tg Substrates Compatible with Both Nitrogen and Air Reflow