Product Overview
ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® NCP-390 Solder Paste |
| Product Name | Semiconductor Solder Pastes for Electronics |
| Joining Process / Product Form | Braze or solder in the form of a paste.; Powder |
