MacDermid Alpha Electronics Solutions Affinity ™ ENEPIG

Simple-to-operate process providing uniform nickel, palladium, and gold deposits with high reliability at the lowest cost of ownership. Product Overview The Affinity ENEPIG process is easy to operate, providing uniform nickel, palladium, and gold deposits with high reliability for soldering and wire bonding applications at the lowest cost of ownership. The proprietary nickel, palladium, and gold baths offer chemical stability during intermittent operation without wasteful plating on equipment. Superior Wire Bond Performance and Solderability The nickel and palladium deposits are consistently uniform and, when paired with hybrid gold deposition, deliver a corrosion-free, highly solderable, and wire-bondable surface. Corrosion Free Deposition Affinity ENEPIG creates a corrosion-free surface, enhancing product reliability. Significant Cost of Ownership Improvement Cost improvements through extremely stable bath chemistry, simplified bath control, elimination of dummy plating, and reduced chemical waste and maintenance.