MacDermid Alpha Electronics Solutions Sterling ®

Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility. Product Overview Our Sterling immersion silver finish delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility. These benefits extend throughout the supply chain. Fabricators receive a versatile solution compatible with both horizontal and vertical equipment. Assemblers benefit from a durable finish that performs well through multiple heat excursions, producing high yields due to complete flux and paste compatibility. OEMs gain unmatched reliability and service life, thanks to the resulting copper/tin solder joint. Sterling consistently delivers strong, durable solder joints. During soldering, the thin silver finish dissolves completely into the bulk solder, resulting in a reliable and resilient copper/tin solder joint. Sterling’s consistent silver plating in blind microvias meets today’s complex technological demands, maximizing circuit board real estate. From automotive to computing, military to communications, Sterling is one of the top choices for OEMs worldwide. It offers high assembly yields, excellent contact functionality, and predictable solderability across multiple reflows. Additionally, it is wire-bondable, providing ultimate assembly flexibility.