Modular TPC - Computing Box Module with Intel® 12th/13th/14th Gen./BTL S Core™ i CPU Socket (LGA1700)
High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design
10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selection
Dual Channel Memory slots (DDR5) support up to 64GB in total
Comprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etc
Supports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)
Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)
Supports Fieldbus protocols/GPS/GPRS/W
i-Fi capabilities via iDoor technology
Supports Diverse system I/O, DIO, PoE...etc. via iDoor technology
Supports TPM 2.0 hardware security
Modular TPC - Computing Box Module with Intel® 12th/13th/14th Gen./BTL S Core™ i CPU Socket (LGA1700)
- High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design
- 10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selection
- Dual Channel Memory slots (DDR5) support up to 64GB in total
- Comprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etc
- Supports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)
- Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)
- Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
- Supports Diverse system I/O, DIO, PoE...etc. via iDoor technology
- Supports TPM 2.0 hardware security
