Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU5CG-2SFVC784I

Description
Win Source Part Number: 1261820-XCZU5CG-2SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU5
Request a Quote Datasheet
Description
Win Source Part Number: 1261820-XCZU5CG-2SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU5
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1261820-XCZU5CG-2SFVC784I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1261820-XCZU5CG-2SFVC784I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1261820-XCZU5CG-2SFVC784I
Win Source Part Number: 1261820-XCZU5CG-2SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU5

Win Source Part Number: 1261820-XCZU5CG-2SFVC784I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 533MHz, 1.3GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 252
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 69 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU5

Buy Now Datasheet

Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1261820-XCZU5CG-2SFVC784I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
Unlock Full Specs
to access all available technical data

Similar Products

DS90UR903Q-Q1 10 - 43MHz 18 Bit Color FPD-Link II Serializer - DS90UR903QSQX/NOPB - Texas Instruments
Specs
Device Type SERDES
Supply Voltage 1.8V
Package Type Other; WQFN
View Details
2 suppliers
Embedded - FPGAs (Field Programmable Gate Array) - EP20K600EFC33-2X - Lingto Electronic Limited
Specs
Device Type FPGA
System Gates 1.54E6
Logic Cells / Logic Blocks 24320
View Details
SDI Receivers & Transmitters -  - Semtech Corp.
Specs
Device Type SERDES
Power Dissipation 525 milliwatts
Package Type Other (optional feature)
View Details
Embedded - FPGAs (Field Programmable Gate Array) - A1425A-1PLG84C - Lingto Electronic Limited
Specs
Device Type FPGA
System Gates 2500
User I/Os 70 pins
View Details