Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z045-1FFG676I

Description
Win Source Part Number: 1195353-XC7Z045-1FFG 676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 75 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045
  • Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1195353-XC7Z045-1FFG676I - Win Source Electronics
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Description
Win Source Part Number: 1195353-XC7Z045-1FFG 676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 75 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1195353-XC7Z045-1FFG676I - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1195353-XC7Z045-1FFG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1195353-XC7Z045-1FFG676I
Win Source Part Number: 1195353-XC7Z045-1FFG 676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 75 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045

Win Source Part Number: 1195353-XC7Z045-1FFG676I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 75 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z045

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1195353-XC7Z045-1FFG676I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
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