ACCRAbond, Inc. Conap™ Industrial Adhesive CONAPOXY® AD-10

Description
CONAPOXY® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200°F, yet it exhibits good storage life at room temperature. Good dielectric properties and thermal stability make this epoxy ideal for electrical applications up to 150°C.
Description
CONAPOXY® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200°F, yet it exhibits good storage life at room temperature. Good dielectric properties and thermal stability make this epoxy ideal for electrical applications up to 150°C.

Suppliers

Company
Product
Description
Supplier Links
Conap™ Industrial Adhesive - CONAPOXY® AD-10 - ACCRAbond, Inc.
Olive Branch, MS, USA
Conap™ Industrial Adhesive
CONAPOXY® AD-10
Conap™ Industrial Adhesive CONAPOXY® AD-10
CONAPOXY® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200°F, yet it exhibits good storage life at room temperature. Good dielectric properties and thermal stability make this epoxy ideal for electrical applications up to 150°C.

CONAPOXY® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200°F, yet it exhibits good storage life at room temperature. Good dielectric properties and thermal stability make this epoxy ideal for electrical applications up to 150°C.

Supplier's Site

Technical Specifications

  ACCRAbond, Inc.
Product Category Industrial Adhesives
Product Number CONAPOXY® AD-10
Product Name Conap™ Industrial Adhesive
Cure / Technology Single Component
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