The ABL Heat Sink for Ball Grid Array (BGA) is designed for efficient thermal management in electronic applications. It features a thermal resistance of 24.5 °C/W, making it suitable for various components requiring effective heat dissipation. The dimensions of the heat sink are 9 mm in height and 21 mm in both width and length, providing a compact solution for space-constrained designs. This product is RoHS compliant, ensuring it meets environmental regulations. Additionally, it comes with thermal tape for easy attachment, enhancing its usability in applications involving microprocessors and chipsets. The thermal tape has excellent thermal conductivity and high-temperature resistance, making it ideal for reliable heat sink attachment.
Heat Sink, For Ball Grid Array, Standard, BGA, 24.5 C/W, 9 mm, 21 mm, 21 mm RoHS Compliant: Yes
| Newark, An Avnet Company | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 89T8646 |
| Product Name | Heat Sink, For Ball Grid Array, Standard, Bga, 24.5 C/w, 9 Mm, 21 Mm, 21 Mm Rohs Compliant Abl Heatsinks |
