VOXMICRO First fully featured 802.11ax (Wi-Fi 6) CoB on Carrier modules AIRETOS E63 Series W

Description
AIRETOS® E63 Class - Series W: First fully featured 802.11ax (Wi-Fi 6) modules for the computing, enterprise, and industrial markets Key Features Fully featured Wi-Fi 6 for the computing, enterprise and industrial markets Dual Band Simultaneous (DBS) with dual MAC Bluetooth 5.1 on a dedicated antenna with Class I mode, ANT+ and BLE Choice of antenna connectors and form factors Up to full Industrial range of operating temperatures Modular Regulatory Certifications (FCC, ISED, CE, Japan) Technical Summary Form Factor M.2 (NGFF) 3030 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping Antenna Type Three on board connectors, two for Wi-Fi and a separate one for BT. Choice of U.Fl. or MHF4 RF Output Power, per chain up to 21.5dBm RF Output Power, combined up to 24.5dBm Industry Standards Wi-Fi CERTIFIED Direct®, Wi-Fi CERTIFIED Miracast® Power Consumption TBD Operating Temperature up to -40 to +90 Celsius Operating System Windows, Linux, macOS, Android Pre-approved Antenna Series WAPH Internal, PCB Dipole < 2.5db WAFH Internal, FPC Dipole < 3db WAMF Internal, F-Type PIFA < 3db WAND External, Omni < 5db WEAD External, PCB Dipole < 5db WACI Internal, SMT Chip < 3db List may vary per domain Our Services Compliance & Regulatory We support customers to bring their wireless products to end use in accordance with their certification needs. Electronic Design Throughout any stage of the development, customers can work with our design team to receive a comprehensive analysis of their applications. Software Engineering We provide the optimal support from custom designs to innovative system-level codebases and development kits. The power of AIRETOS® E63 Class The AIRETOS® E63 Class sets a new industry benchmark by marrying state-of-the-art Wi-Fi 6 and Bluetooth 5.1 capabilities with extended features and leading-edge design. As consumer and enterprise expectations for always-on, flawless data streaming, robust indoor and outdoor wireless connectivity coverage, and reliable security continue to dramatically grow, these advanced solutions face increasing challenges with respect to battery life, data rates, and range. The E63 Class reflects VOXMICRO’s continuing commitment to leadership in the wireless connectivity era by delivering first in the market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm’s new innovative QCA6391 connectivity Chip-on-Board (CoB).
Datasheet
Description
AIRETOS® E63 Class - Series W: First fully featured 802.11ax (Wi-Fi 6) modules for the computing, enterprise, and industrial markets Key Features Fully featured Wi-Fi 6 for the computing, enterprise and industrial markets Dual Band Simultaneous (DBS) with dual MAC Bluetooth 5.1 on a dedicated antenna with Class I mode, ANT+ and BLE Choice of antenna connectors and form factors Up to full Industrial range of operating temperatures Modular Regulatory Certifications (FCC, ISED, CE, Japan) Technical Summary Form Factor M.2 (NGFF) 3030 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping Antenna Type Three on board connectors, two for Wi-Fi and a separate one for BT. Choice of U.Fl. or MHF4 RF Output Power, per chain up to 21.5dBm RF Output Power, combined up to 24.5dBm Industry Standards Wi-Fi CERTIFIED Direct®, Wi-Fi CERTIFIED Miracast® Power Consumption TBD Operating Temperature up to -40 to +90 Celsius Operating System Windows, Linux, macOS, Android Pre-approved Antenna Series WAPH Internal, PCB Dipole < 2.5db WAFH Internal, FPC Dipole < 3db WAMF Internal, F-Type PIFA < 3db WAND External, Omni < 5db WEAD External, PCB Dipole < 5db WACI Internal, SMT Chip < 3db List may vary per domain Our Services Compliance & Regulatory We support customers to bring their wireless products to end use in accordance with their certification needs. Electronic Design Throughout any stage of the development, customers can work with our design team to receive a comprehensive analysis of their applications. Software Engineering We provide the optimal support from custom designs to innovative system-level codebases and development kits. The power of AIRETOS® E63 Class The AIRETOS® E63 Class sets a new industry benchmark by marrying state-of-the-art Wi-Fi 6 and Bluetooth 5.1 capabilities with extended features and leading-edge design. As consumer and enterprise expectations for always-on, flawless data streaming, robust indoor and outdoor wireless connectivity coverage, and reliable security continue to dramatically grow, these advanced solutions face increasing challenges with respect to battery life, data rates, and range. The E63 Class reflects VOXMICRO’s continuing commitment to leadership in the wireless connectivity era by delivering first in the market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm’s new innovative QCA6391 connectivity Chip-on-Board (CoB).
Datasheet

Suppliers

Company
Product
Description
Supplier Links
First fully featured 802.11ax (Wi-Fi 6) CoB on Carrier modules - AIRETOS E63 Series W - VOXMICRO
Diamond Bar, CA, United States
First fully featured 802.11ax (Wi-Fi 6) CoB on Carrier modules
AIRETOS E63 Series W
First fully featured 802.11ax (Wi-Fi 6) CoB on Carrier modules AIRETOS E63 Series W
AIRETOS® E63 Class - Series W: First fully featured 802.11ax (Wi-Fi 6) modules for the computing, enterprise, and industrial markets Key Features Fully featured Wi-Fi 6 for the computing, enterprise and industrial markets Dual Band Simultaneous (DBS) with dual MAC Bluetooth 5.1 on a dedicated antenna with Class I mode, ANT+ and BLE Choice of antenna connectors and form factors Up to full Industrial range of operating temperatures Modular Regulatory Certifications (FCC, ISED, CE, Japan) Technical Summary Form Factor M.2 (NGFF) 3030 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping Antenna Type Three on board connectors, two for Wi-Fi and a separate one for BT. Choice of U.Fl. or MHF4 RF Output Power, per chain up to 21.5dBm RF Output Power, combined up to 24.5dBm Industry Standards Wi-Fi CERTIFIED Direct®, Wi-Fi CERTIFIED Miracast® Power Consumption TBD Operating Temperature up to -40 to +90 Celsius Operating System Windows, Linux, macOS, Android Pre-approved Antenna Series WAPH Internal, PCB Dipole < 2.5db WAFH Internal, FPC Dipole < 3db WAMF Internal, F-Type PIFA < 3db WAND External, Omni < 5db WEAD External, PCB Dipole < 5db WACI Internal, SMT Chip < 3db List may vary per domain Our Services Compliance & Regulatory We support customers to bring their wireless products to end use in accordance with their certification needs. Electronic Design Throughout any stage of the development, customers can work with our design team to receive a comprehensive analysis of their applications. Software Engineering We provide the optimal support from custom designs to innovative system-level codebases and development kits. The power of AIRETOS® E63 Class The AIRETOS® E63 Class sets a new industry benchmark by marrying state-of-the-art Wi-Fi 6 and Bluetooth 5.1 capabilities with extended features and leading-edge design. As consumer and enterprise expectations for always-on, flawless data streaming, robust indoor and outdoor wireless connectivity coverage, and reliable security continue to dramatically grow, these advanced solutions face increasing challenges with respect to battery life, data rates, and range. The E63 Class reflects VOXMICRO’s continuing commitment to leadership in the wireless connectivity era by delivering first in the market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm’s new innovative QCA6391 connectivity Chip-on-Board (CoB).

AIRETOS® E63 Class - Series W: First fully featured 802.11ax (Wi-Fi 6) modules for the computing, enterprise, and industrial markets

Key Features

  • Fully featured Wi-Fi 6 for the computing, enterprise and industrial markets
  • Dual Band Simultaneous (DBS) with dual MAC
  • Bluetooth 5.1 on a dedicated antenna with Class I mode, ANT+ and BLE
  • Choice of antenna connectors and form factors
  • Up to full Industrial range of operating temperatures
  • Modular Regulatory Certifications (FCC, ISED, CE, Japan)

Technical Summary

Form FactorM.2 (NGFF) 3030 E-Key
ChipsetQualcomm QCA6391, with IC-external FEMs (RF360)
StandardIEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1
Data Transfer RatesUp to 1775Mbps (dynamic)
Industrial ReferenceBased on Qualcomm reference design (Hastings)
Communications InterfaceWLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping
Antenna TypeThree on board connectors, two for Wi-Fi and a separate one for BT. Choice of U.Fl. or MHF4
RF Output Power, per chainup to 21.5dBm
RF Output Power, combinedup to 24.5dBm
Industry StandardsWi-Fi CERTIFIED Direct®, Wi-Fi CERTIFIED Miracast®
Power ConsumptionTBD
Operating Temperatureup to -40 to +90 Celsius
Operating SystemWindows, Linux, macOS, Android

Pre-approved Antenna Series

WAPHInternal, PCB Dipole< 2.5db
WAFHInternal, FPC Dipole< 3db
WAMFInternal, F-Type PIFA< 3db
WANDExternal, Omni< 5db
WEADExternal, PCB Dipole< 5db
WACIInternal, SMT Chip< 3db
List may vary per domain

Our Services

Compliance & RegulatoryWe support customers to bring their wireless products to end use in accordance with their certification needs.
Electronic DesignThroughout any stage of the development, customers can work with our design team to receive a comprehensive analysis of their applications.
Software EngineeringWe provide the optimal support from custom designs to innovative system-level codebases and development kits.

The power of AIRETOS® E63 Class

The AIRETOS® E63 Class sets a new industry benchmark by marrying state-of-the-art Wi-Fi 6 and Bluetooth 5.1 capabilities with extended features and leading-edge design. As consumer and enterprise expectations for always-on, flawless data streaming, robust indoor and outdoor wireless connectivity coverage, and reliable security continue to dramatically grow, these advanced solutions face increasing challenges with respect to battery life, data rates, and range. The E63 Class reflects VOXMICRO’s continuing commitment to leadership in the wireless connectivity era by delivering first in the market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm’s new innovative QCA6391 connectivity Chip-on-Board (CoB).
Supplier's Site Datasheet

Technical Specifications

  VOXMICRO
Product Category Wireless Network Components
Product Number AIRETOS E63 Series W
Product Name First fully featured 802.11ax (Wi-Fi 6) CoB on Carrier modules
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