Texas Instruments Integrated Circuits (ICs) - Memory - Memory JM38510/23103BFA

Description
STATIC RAM, 1K X 1, LOW-POWER, W
  • Memory - JM38510/23103BFA - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Description
STATIC RAM, 1K X 1, LOW-POWER, W

Suppliers

Company
Product
Description
Supplier Links
Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
JM38510/23103BFA
Integrated Circuits (ICs) - Memory - Memory JM38510/23103BFA
STATIC RAM, 1K X 1, LOW-POWER, W

STATIC RAM, 1K X 1, LOW-POWER, W

Supplier's Site
Memory - JM38510/23103BFA - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory
JM38510/23103BFA
Memory JM38510/23103BFA
Memory IC

Memory IC

Buy Now

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number JM38510/23103BFA JM38510/23103BFA
Product Name Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 2420768P - RS Components, Ltd.
RS Components, Ltd.
SDRAM
2420768P
Specs
Memory Category DRAM Chip
Access Time 20 ns
Operating Temperature -40 C (-40 F)
View Details
Memory - 27C128-20/UC - Lingto Electronic Limited
Rochester Electronics
Memory
27C128-20/UC
Specs
Memory Category EPROM; EPROM
Access Time 200 ns
Density 128 kbits
View Details
Memory IC and Storage Component - 736-DP8429TD-70 - ERSAELECTRONICS PTE. LTD.
Texas Instruments
Memory IC and Storage Component
DP8429TD-70
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
3 suppliers
Memory - AS4SD32M16 - Micross Components, Inc.
Micross Components, Inc.
Memory
AS4SD32M16
Specs
Memory Category SDRAM; DRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 256000 kbits
View Details