ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | TechniPad ENIG |
| Product Name | Electroless Nickel Immersion Gold Process |
| Chemical / Composition | Gold Plating; Hard Nickel Plating |
