Edwards Vacuum Temescal FC-3800

Description
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch x38 inch x 28 inch box type product chamber is pumped by a high throughput 16 inch cyro pump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of dedicated 10 inch cryo pump.
Description
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch x38 inch x 28 inch box type product chamber is pumped by a high throughput 16 inch cyro pump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of dedicated 10 inch cryo pump.

Suppliers

Company
Product
Description
Supplier Links
Temescal - FC-3800 - Edwards Vacuum
Crawley, West Sussex, United Kingdom
Temescal
FC-3800
Temescal FC-3800
The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch x38 inch x 28 inch box type product chamber is pumped by a high throughput 16 inch cyro pump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of dedicated 10 inch cryo pump.

The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch x38 inch x 28 inch box type product chamber is pumped by a high throughput 16 inch cyro pump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of dedicated 10 inch cryo pump.

Supplier's Site

Technical Specifications

  Edwards Vacuum
Product Category Thin Film Equipment
Product Number FC-3800
Product Name Temescal
Process Physical Vapor Deposition; Electron Beam Evaporation
Applications Research / Surface Analysis
Materials Processed Metal
Wafer / Part Size 152 mm (6 inch)
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