Qnnect, formerly Hermetic Solutions Group Stepped & Flat Lids

The lid and the lidding process are often considered to be one of the least exciting aspects of hermetic microelectronic packaging. There are often many technical challenges in the design and manufacture of a new device and, unless a radical new packaging technique is also being developed, the lid seal is often taken for granted. However, Hermetic Solutions Group gets it; we are a supplier that thoroughly understands the hermetic lid sealing process and the fundamental differences and requirements for different techniques. As a result we have multiple technologies and product offerings to address all types of lidding processes.