Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
Features & Benefits
Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches
Custom pitches down to 0.35 mm
Lidded and Open Top Sockets for ≤10 mm packages
Lidded Sockets for 10 mm to 16 mm packages
Center ground pin standard for all sockets
Optional copper heat slug available for high wattage devices
Sockets for over 80 different JEDEC standard footprints
Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
Features & Benefits
- Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches
- Custom pitches down to 0.35 mm
- Lidded and Open Top Sockets for ≤10 mm packages
- Lidded Sockets for 10 mm to 16 mm packages
- Center ground pin standard for all sockets
- Optional copper heat slug available for high wattage devices
- Sockets for over 80 different JEDEC standard footprints
