Smiths Interconnect, a Molex company Kepler Test Socket: High performance scrub contact technology for Peripheral IC

The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe. The design includes horizontal movement during the downward stroke of the device to remove surface oxides, provide stable and reliable contact, and cause no damage to the PCB. Features & Benefits Technical Features: For testing LGA, QFN, QFP and other variants Scrub action breaks through surface oxides on device pad Short signal path Tri-Temp socket design to support -55 °C to +150 °C Configurable design flexibility for integrating into existing hardware setups Designed for manual test, bench test, and HVM production test Insulator housing made from high-performance polyimide Small socket footprint Benefits: Long contact life, low wear, tested to over 500K insertions Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low consistent Cres Exceptional signal integrity Covers wide range of test applications Match existing PCB socket footprint and test hardware lead to cost saving for customers Field repairable, easy cleaning and maintenance Low Dielectric constant, Low CLTE, exceptional Flexural Modulus Allows for PCB topside components to be placed close to DUT for better signal performance and less signal loss