Smiths Interconnect, a Molex company CEA Series: Data Transfer Rectangular Connectors

Description
CEA data transfer connectors for industrial applications. 1.5mm nominal pin DIA contact size; 3, 5 and 9 contact positions; Right angle through board solder, Straight through board solder, Solder cup and Crimp termination styles. Features & Benefits Offset grid contact layout, one or two contact rows within dielectric connector body 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions Hand solder, dip solder and crimp termination styles.
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Description
CEA data transfer connectors for industrial applications. 1.5mm nominal pin DIA contact size; 3, 5 and 9 contact positions; Right angle through board solder, Straight through board solder, Solder cup and Crimp termination styles. Features & Benefits Offset grid contact layout, one or two contact rows within dielectric connector body 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions Hand solder, dip solder and crimp termination styles.
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Suppliers

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CEA Series: Data Transfer Rectangular Connectors -  - Smiths Interconnect, a Molex company
London, United Kingdom
CEA Series: Data Transfer Rectangular Connectors
CEA Series: Data Transfer Rectangular Connectors
CEA data transfer connectors for industrial applications. 1.5mm nominal pin DIA contact size; 3, 5 and 9 contact positions; Right angle through board solder, Straight through board solder, Solder cup and Crimp termination styles. Features & Benefits Offset grid contact layout, one or two contact rows within dielectric connector body 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions Hand solder, dip solder and crimp termination styles.

CEA data transfer connectors for industrial applications. 1.5mm nominal pin DIA contact size; 3, 5 and 9 contact positions; Right angle through board solder, Straight through board solder, Solder cup and Crimp termination styles.

Features & Benefits

  • Offset grid contact layout, one or two contact rows within dielectric connector body
  • 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
  • 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
  • Hand solder, dip solder and crimp termination styles.
Supplier's Site

Technical Specifications

  Smiths Interconnect, a Molex company
Product Category Electrical Connectors
Product Name CEA Series: Data Transfer Rectangular Connectors
Connector Type Rectangular Connectors, Heavy Duty
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